E. Wachmann, S. Saponara, C. Zambelli, P. Tisserand, J. Charbonnier, T. Erlbacher, S. Gruenler, C. Hartler, J. Siegert, P. Chassard, D. Ton, L. Ferrari, L. Fanucci
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ATHENIS_3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology
The ATHENIS_3D FP7 EU project aims at providing new enabling technologies (analog, digital and power components) for high-voltage and high-temperature applications, tested for power systems of new hybrid/electrical vehicles. Innovation is exploited at process/device level (3D chip stacking, wafer level packaging, trench capacitors and TSV-inductors integrated in the interposer, high-reliable non-volatile Magnetic RAM), circuit-level (inductorless high-voltage DC-DC converter, high-temperature 28nm System-on-Chip platform) and system-level (compact 3D embedded power mechatronic system). Enabling high integration levels of complex systems, operating in harsh environments, in a single packaged 3D device, ATHENIS_3D allows for one order of magnitude area reduction vs. today PCB-based power and control systems. Integration costs will be consequently reduced in key industrial sectors for Europe where high-voltage/temperature operations are mandatory (vehicles, avionics, space/defense, industrial automation, energy).
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