不同偏置条件下70nm nMOSFET的热载流子应力

Hyun-Sik Choi, S. Hong, Hee-Sung Kang, Y. Jeong
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引用次数: 0

摘要

本研究提出了一种利用热载流子应力降解70 nm nMOSFET的方法。在70 nm nMOSFET中,研究了热载流子应力前后器件的直流性能漂移。尽管70nm nMOSFET的衬底电流与长沟道器件的衬底电流具有不同的特性,但它可以很好地指示热载子应力。使用测量寿命与1/VDS图估计器件寿命的工业实践不能应用于70 nm nMOSFET,但使用衬底电流的方法对该应用很有用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hot carrier stress in 70-nm nMOSFET with various bias conditions
This study presents a 70-nm nMOSFET degradation by hot carrier stress. The DC performance drifts of the device due to hot carrier stress are examined experimentally before and after stress for a 70-nm nMOSFET. Although the substrate current of a 70-nm nMOSFET has different characteristics from that of a long channel device, it can be a good indicator of hot carrier stress. The industrial practice to estimate the device lifetime using the measured lifetime versus 1/VDS plot cannot be applied to a 70-nm nMOSFET, but the method using the substrate current is useful to for this application.
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