16nm下FinFET和CMOS XOR电路的PVT变异性分析

F. A. D. Silva, P. Butzen, C. Meinhardt
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引用次数: 10

摘要

本工作比较了16nm器件技术(CMOS Bulk和FinFET)中PVT可变性效应下XOR逻辑门的许多不同晶体管排列。目的是确定这两种不同的设备技术如何处理PVT可变性对性能和功率特性的影响。评估10种不同的异或拓扑。结果表明,不同的晶体管排列方式对PVT变异性有不同的影响。FinFET技术对PVT变化有较好的延迟效果。CMOS Bulk技术在功耗分析中具有较好的鲁棒性。考虑到集成电路提交的不同条件,结果提供了有价值的数据,并表明可变性的影响是必须探索的重要因素,以便在最合适的技术中设计更健壮的电路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
PVT variability analysis of FinFET and CMOS XOR circuits at 16nm
This work compares many different transistors arrangements of XOR logic gates under PVT variability effect in 16nm device technologies: CMOS Bulk and FinFET. The objective is to identify how these two different device technologies deal with PVT variability effects on performance and power characteristics. Ten different XOR topologies are evaluated. The results show different transistor arrangements have distinct behavior under PVT variability. FinFET technology show better delay results for PVT variation. CMOS Bulk technology obtained better robustness in power analysis. Considering the different conditions that the integrated circuits are submitted, the results provide valuable data and show that the impact of variability is an important factor that has to be explored to design more robust circuits in the most appropriated technology.
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