400Gbit/s光模块集成散热微结构研究

2019 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD) Pub Date : 2019-07-01 DOI:10.1109/NUSOD.2019.8806931

Xu Liu, Jiaxu Dong, Zhekai Zhang, Xiaohan Sun

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引用次数: 2

摘要

由于高容量信息传输的需要，400Gbit/s光模块将很快大规模商用。它具有比100Gbit/s和40Gbit/s高得多的功率密度，因此热管理仍然是一个障碍。提出了一种包含μ通道、μ池、石墨烯热垫、横向和纵向传递路径的集成散热微结构(ITDMS)，并通过数值验证了其对CDFP光模块的有效散热。

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An Integrated Thermal Dissipation Micro Structure for 400Gbit/s Optical Module

400Gbit/s optical module will soon be commercially deployed on a large scale due to the need for high capacity information transmission. It has much higher power density than that of 100Gbit/s and 40Gbit/s and therefore the thermal management still remains an obstacle. An integrated thermal dissipation micro structure (ITDMS) including μ-channel, μ-pool, graphene thermal pad with lateral and longitudinal transfer paths proposed and numerically validated for effective heat dissipation of CDFP optical modules.

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2019 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD)

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