自顶向下制造带有欧姆金属触点的InP纳米线的方法

S. Naureen, N. Shahid, K. Vora, M. Lysevych, H. Tan, C. Jagadish, F. Karouta
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引用次数: 0

摘要

金属和半导体之间的电接触对于实用的半导体器件是至关重要的。这项工作报告了自上而下方法制备的纳米线阵列的电学特性,其中电子束光刻(EBL)和高度各向异性的Cl2/H2/Ar电感耦合等离子体(ICP)反应离子蚀刻(RIE)被用于生成InP纳米线阵列的垂直阵列。初步结果显示了这些阵列的欧姆行为。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Top-down approach for fabricating InP nanowires with ohmic metal contacts
Electrical contacts between metals and semiconductors are fundamentally important for practical semiconductor devices. This work reports the electrical characterization of nanowire arrays fabricated by a top-down approach, where electron beam lithography (EBL) and a highly anisotropic Cl2/H2/Ar inductively coupled plasma (ICP) reactive ion etching (RIE) is utilised to generate vertical arrays of InP nanowire arrays. Preliminary results show ohmic behavior from these arrays.
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