I. Ndip, K. Becker, F. Brandenburger, T. H. Le, M. Huhn, J. Bauer, M. Koch, M. Hempel, M. Schneider-Ramelow, K. Lang
{"title":"键合线真的可以用作天线吗?","authors":"I. Ndip, K. Becker, F. Brandenburger, T. H. Le, M. Huhn, J. Bauer, M. Koch, M. Hempel, M. Schneider-Ramelow, K. Lang","doi":"10.1109/ESTC.2018.8546432","DOIUrl":null,"url":null,"abstract":"We model, design, fabricate and measure bond wire antennas (BWAs) at mmWave frequencies, considering the impact of encapsulation and process variations which occur during fabrication. Our results reveal that BWAs can withstand the fabrication process, and retain their impedance and radiation characteristics, if properly designed. Therefore, we believe that bond wires can be used as antennas for the development of real-world wireless systems.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"92 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Can Bond Wires really be used as Antennas?\",\"authors\":\"I. Ndip, K. Becker, F. Brandenburger, T. H. Le, M. Huhn, J. Bauer, M. Koch, M. Hempel, M. Schneider-Ramelow, K. Lang\",\"doi\":\"10.1109/ESTC.2018.8546432\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We model, design, fabricate and measure bond wire antennas (BWAs) at mmWave frequencies, considering the impact of encapsulation and process variations which occur during fabrication. Our results reveal that BWAs can withstand the fabrication process, and retain their impedance and radiation characteristics, if properly designed. Therefore, we believe that bond wires can be used as antennas for the development of real-world wireless systems.\",\"PeriodicalId\":198238,\"journal\":{\"name\":\"2018 7th Electronic System-Integration Technology Conference (ESTC)\",\"volume\":\"92 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 7th Electronic System-Integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2018.8546432\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 7th Electronic System-Integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2018.8546432","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We model, design, fabricate and measure bond wire antennas (BWAs) at mmWave frequencies, considering the impact of encapsulation and process variations which occur during fabrication. Our results reveal that BWAs can withstand the fabrication process, and retain their impedance and radiation characteristics, if properly designed. Therefore, we believe that bond wires can be used as antennas for the development of real-world wireless systems.