{"title":"基于现场的高针数板连接器设计，用于高数据速率传输","authors":"H. Katzier, B. Keller, P. Pagnin","doi":"10.1109/ECTC.1996.517427","DOIUrl":null,"url":null,"abstract":"We present the results of a field-based 3D time domain simulation of a new board connector. The connector is a high pincount SpeedPac(R) connector with four rows providing 136 high frequency twinax chambers per 100 mm. The results of the field simulation are the near- and far-end crosstalk, the reflection and transmission characteristics in the time and frequency domain. For the field simulation we use the program package MAFIA(R), which is based on the Finite-Integration-Technique (FIT). We also present results obtained from a reliable SPICE model of the SpeedPac(R) connector. By means of typical measurements and simulation results the reliability of the SPICE(R)-Model is demonstrated. All important electrical characteristics of the connector can be simulated by the SPICE(R)-Model. The comparison between the field simulation, the SPICE(R)-simulation and measurement is very good up to a limit of f=4 GHz and risetimes of tr>50 ps.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Field-based design of a new high pincount board connector for high data rate transmission\",\"authors\":\"H. Katzier, B. Keller, P. Pagnin\",\"doi\":\"10.1109/ECTC.1996.517427\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present the results of a field-based 3D time domain simulation of a new board connector. The connector is a high pincount SpeedPac(R) connector with four rows providing 136 high frequency twinax chambers per 100 mm. The results of the field simulation are the near- and far-end crosstalk, the reflection and transmission characteristics in the time and frequency domain. For the field simulation we use the program package MAFIA(R), which is based on the Finite-Integration-Technique (FIT). We also present results obtained from a reliable SPICE model of the SpeedPac(R) connector. By means of typical measurements and simulation results the reliability of the SPICE(R)-Model is demonstrated. All important electrical characteristics of the connector can be simulated by the SPICE(R)-Model. The comparison between the field simulation, the SPICE(R)-simulation and measurement is very good up to a limit of f=4 GHz and risetimes of tr>50 ps.\",\"PeriodicalId\":143519,\"journal\":{\"name\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1996.517427\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 Proceedings 46th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1996.517427","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Field-based design of a new high pincount board connector for high data rate transmission
We present the results of a field-based 3D time domain simulation of a new board connector. The connector is a high pincount SpeedPac(R) connector with four rows providing 136 high frequency twinax chambers per 100 mm. The results of the field simulation are the near- and far-end crosstalk, the reflection and transmission characteristics in the time and frequency domain. For the field simulation we use the program package MAFIA(R), which is based on the Finite-Integration-Technique (FIT). We also present results obtained from a reliable SPICE model of the SpeedPac(R) connector. By means of typical measurements and simulation results the reliability of the SPICE(R)-Model is demonstrated. All important electrical characteristics of the connector can be simulated by the SPICE(R)-Model. The comparison between the field simulation, the SPICE(R)-simulation and measurement is very good up to a limit of f=4 GHz and risetimes of tr>50 ps.
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