智能电力设备的技术CAD

T. Simlinger, C. Pichler, R. Plasun, S. Selberherr
{"title":"智能电力设备的技术CAD","authors":"T. Simlinger, C. Pichler, R. Plasun, S. Selberherr","doi":"10.1109/SMICND.1997.651201","DOIUrl":null,"url":null,"abstract":"Technology CAD has already proven to be an attractive supplement to standard process development methodologies for VLSI technology. The Vienna Integrated System for TCAD Applications is such a simulation environment which offers great flexibility and a large number of tools for process development. On the other hand smart power devices gain increasingly interest for applications which need to combine low voltage logic and power output devices as, e.g. for automotive electronics. The flexibility of TCAD makes it also applicable for smart power technology to cut down development costs and cycle times.","PeriodicalId":144314,"journal":{"name":"1997 International Semiconductor Conference 20th Edition. CAS '97 Proceedings","volume":"765 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Technology CAD for smart power devices\",\"authors\":\"T. Simlinger, C. Pichler, R. Plasun, S. Selberherr\",\"doi\":\"10.1109/SMICND.1997.651201\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Technology CAD has already proven to be an attractive supplement to standard process development methodologies for VLSI technology. The Vienna Integrated System for TCAD Applications is such a simulation environment which offers great flexibility and a large number of tools for process development. On the other hand smart power devices gain increasingly interest for applications which need to combine low voltage logic and power output devices as, e.g. for automotive electronics. The flexibility of TCAD makes it also applicable for smart power technology to cut down development costs and cycle times.\",\"PeriodicalId\":144314,\"journal\":{\"name\":\"1997 International Semiconductor Conference 20th Edition. CAS '97 Proceedings\",\"volume\":\"765 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 International Semiconductor Conference 20th Edition. CAS '97 Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.1997.651201\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 International Semiconductor Conference 20th Edition. CAS '97 Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.1997.651201","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

技术CAD已经被证明是一个有吸引力的补充标准工艺开发方法的VLSI技术。维也纳TCAD应用集成系统就是这样一个仿真环境,它为过程开发提供了极大的灵活性和大量的工具。另一方面,智能功率器件对于需要结合低压逻辑和功率输出器件的应用越来越感兴趣,例如用于汽车电子。TCAD的灵活性使其也适用于智能电源技术,以降低开发成本和周期时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Technology CAD for smart power devices
Technology CAD has already proven to be an attractive supplement to standard process development methodologies for VLSI technology. The Vienna Integrated System for TCAD Applications is such a simulation environment which offers great flexibility and a large number of tools for process development. On the other hand smart power devices gain increasingly interest for applications which need to combine low voltage logic and power output devices as, e.g. for automotive electronics. The flexibility of TCAD makes it also applicable for smart power technology to cut down development costs and cycle times.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信