ti掺杂ZnO薄膜作为tft沟道层的适用性分析

K. Jeong, Young-Su Kim, Yu-Mi Kim, J. Park, Seung-Dong Yang, H. Yun, H. Lee, Ga-Won Lee
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引用次数: 4

摘要

本文采用射频溅射Zn和直流磁控溅射Ti的方法,成功地在SiO2/Si衬底上制备了Ti掺杂ZnO tft。用未掺杂的ZnO tft,在300℃的O2气氛下,比较了生长态掺钛ZnO和退火态掺钛ZnO tft。随着退火时间的延长,ti掺杂ZnO TFT的亚阈值斜率(SS)和通断电流比等电学特性变得更好。为了找出性能提高的原因,进行了光学分析。XRD和AFM数据表明,随着退火时间的延长,掺杂ZnO的晶粒尺寸和均方根粗糙度增大,势势势势和功函数均小于未掺杂ZnO,表明在O2气氛下退火后性能的提高是由于掺杂ZnO薄膜的结晶重组所致。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An analysis on applicability of Ti-doped ZnO films as the channel layer of TFTs
In this paper, Ti-doped ZnO TFTs on SiO2/Si substrates by simultaneous RF sputter of Zn and DC magnetron sputter of Ti are successfully fabricated. With undoped ZnO TFTs, as-grown Ti-doped ZnO are compared with post-annealed Ti-doped ZnO TFTs in the furnace at O2 atmosphere of 300 °C. As the annealing time increases, the electrical characteristics such as sub-threshold slop (SS) and on/off current ratio of Ti-doped ZnO TFT become better. In order to find out the reason of performance improvement, the optical analysis is carried out. The data of XRD and AFM indicate that grain size and RMS (root mean square) roughness increase in accordance with annealing time, and the potential barrier and work function of Ti-doped ZnO is smaller than that of undoped ZnO, which indicates that the performance improvement by post-annealing in O2 atmosphere is due to a crystalline reformation in Ti-doped ZnO films.
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