I.V. Petrova, M.T. Uppuluri, S. Tewksbury, L. Hornak
{"title":"硅片区域网络:用于并行计算的智能通信结构","authors":"I.V. Petrova, M.T. Uppuluri, S. Tewksbury, L. Hornak","doi":"10.1109/ICWSI.1994.291237","DOIUrl":null,"url":null,"abstract":"The SWAN (silicon wafer-area network) project described explores the application of the high speed and high density of interconnections in WSI and MCM technologies to new communications schemes for general purpose, parallel arrays of computing nodes. The SWAN architecture seeks to provide on-demand, point-to-point communications through dynamically allocated routes for fine-grained communications.<<ETX>>","PeriodicalId":183733,"journal":{"name":"Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)","volume":"125 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-01-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Silicon wafer-area network: intelligent communications fabric for parallel computing\",\"authors\":\"I.V. Petrova, M.T. Uppuluri, S. Tewksbury, L. Hornak\",\"doi\":\"10.1109/ICWSI.1994.291237\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The SWAN (silicon wafer-area network) project described explores the application of the high speed and high density of interconnections in WSI and MCM technologies to new communications schemes for general purpose, parallel arrays of computing nodes. The SWAN architecture seeks to provide on-demand, point-to-point communications through dynamically allocated routes for fine-grained communications.<<ETX>>\",\"PeriodicalId\":183733,\"journal\":{\"name\":\"Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)\",\"volume\":\"125 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-01-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICWSI.1994.291237\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICWSI.1994.291237","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Silicon wafer-area network: intelligent communications fabric for parallel computing
The SWAN (silicon wafer-area network) project described explores the application of the high speed and high density of interconnections in WSI and MCM technologies to new communications schemes for general purpose, parallel arrays of computing nodes. The SWAN architecture seeks to provide on-demand, point-to-point communications through dynamically allocated routes for fine-grained communications.<>