低压差分信号(LVDS)应用互连的解空间分析

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967674

Seungyoung Ahn, A. Lu, W. Fan, L.W. Lai, Joungho Kim

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引用次数: 3

摘要

本文提出了低压差分信号(LVDS)应用中差分互连的解空间分析方法。通过频域三维全波仿真、TDR测量和时域瞬态仿真对互连性能进行了评价。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Solution space analysis of interconnects for low voltage differential signaling (LVDS) applications

This paper presents a solution space analysis of differential interconnects for low voltage differential signal (LVDS) applications. The interconnect performance has been evaluated using frequency-domain 3-D full-wave simulation, TDR measurement and time-domain transient simulation.

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来源期刊

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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