高分子材料微波固化研究进展

Tiebing Wang, Johan Liu
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引用次数: 32

摘要

聚合物和聚合物基复合材料广泛应用于电子封装行业。出于成本效益的考虑,有必要缩短处理时间。微波辐射被认为是传统热处理的一种替代方法。本文介绍了微波作为聚合物固化热源的基本概念。在查阅文献的基础上,对热法和微波法进行了比较。分析了影响MW应用的各种变量。讨论了金属填充导电胶粘剂在微波辐射下的金属效应。最后得出结论:微波作为能量源可以提供比热处理更高的加工速率,并且对加工材料的性能没有不利影响;更高的升温速率将需要考虑各种变量的影响;金属填充导电胶粘剂可以用变频微波加热而不产生电弧。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A review of microwave curing of polymer materials
Polymer and polymer-based composites are widely used in the electronic packaging industry. There is a need to shorten the processing time for cost-effective reasons. Microwave radiation is recognized as an alternative to the conventional thermal treatment. This paper presents the fundamental concept of MW used as heating source for curing polymers. Upon literature survey, comparison between thermal and MW approaches was given. Various variables affecting MW applications were analyzed. Metal effect under microwave radiation was also discussed corresponding to the metal-filled electrically conductive adhesives. At last, a conclusion was made that microwave as the source of energy can offer higher processing rate than thermal treatment while no adverse effect is exerted on the properties of the processed materials; an even higher heating rate will require considerations of the influence of various variables; metal-filled electrically conductive adhesives could be heated with variable frequency microwave with no arcing being incurred.
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