微电子领域环氧基高填充贴片材料的表征

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI:10.1109/EUROSIME.2017.7926237

I. Maus, C. Liebl, M. Fink, D. Vu, M. Hartung, H. Preu, K. Jansen, B. Michel, B. Wunderle, L. Weiss

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引用次数: 3

摘要

在半导体技术中，导热和导电胶粘剂被广泛用于将芯片附着在衬底上。本研究的重点是高导电性填充颗粒的各向同性导电胶粘剂(ICA)及其表征。

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Characterization of epoxy based highly filled die attach materials in microelectronics

In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.

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来源期刊

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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