智能传感器实现PicoBlaze多处理器技术

L. Claudiu, S. Sebastian, B. Cristian
{"title":"智能传感器实现PicoBlaze多处理器技术","authors":"L. Claudiu, S. Sebastian, B. Cristian","doi":"10.1109/SIITME.2012.6384384","DOIUrl":null,"url":null,"abstract":"This paper presents an innovative implementation of smart sensor, based on multi-processor technology that can be used in industrial, automation, medical applications or in live assisted applications. This model of sensor offers some advantages like parallel processing, flexible structure and short time and low cost of implementation.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Smart sensor implemented with PicoBlaze multi-processors technology\",\"authors\":\"L. Claudiu, S. Sebastian, B. Cristian\",\"doi\":\"10.1109/SIITME.2012.6384384\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an innovative implementation of smart sensor, based on multi-processor technology that can be used in industrial, automation, medical applications or in live assisted applications. This model of sensor offers some advantages like parallel processing, flexible structure and short time and low cost of implementation.\",\"PeriodicalId\":273985,\"journal\":{\"name\":\"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-12-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SIITME.2012.6384384\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIITME.2012.6384384","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

摘要

本文提出了一种基于多处理器技术的智能传感器的创新实现,可用于工业、自动化、医疗应用或现场辅助应用。该传感器具有并行处理、结构灵活、实现时间短、成本低等优点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Smart sensor implemented with PicoBlaze multi-processors technology
This paper presents an innovative implementation of smart sensor, based on multi-processor technology that can be used in industrial, automation, medical applications or in live assisted applications. This model of sensor offers some advantages like parallel processing, flexible structure and short time and low cost of implementation.
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