D. Peters, P. Friedrichs, R. Schorner, H. Mitlehner, B. Weis, D. Stephani
{"title":"低导通电阻三重植入垂直碳化硅mosfet的电学性能","authors":"D. Peters, P. Friedrichs, R. Schorner, H. Mitlehner, B. Weis, D. Stephani","doi":"10.1109/ISPSD.1999.764071","DOIUrl":null,"url":null,"abstract":"This paper describes results of 6H silicon carbide vertical power MOSFETs designed for different blocking capabilities: 600 V and 1600 V. The fabrication is based on a triple implantation technique with a lateral inversion channel. The MOSFETs are normally off and exhibit specific on-resistances of 22 and 40 m/spl Omega/cm/sup 2/, respectively. A chip area of 1 mm/sup 2/ has emerged as a suitable value in order to achieve an acceptable yield with respect to the blocking capability. A SiC MOSFET of this size can be driven up to 1 A in continuous operation. As expected for a unipolar device, short turn-on and turn-off delay times have been measured. In particular, due to a very small accumulation zone, the Miller capacitance is small in comparison to Si MOSFETs. The switching speed can be influenced by the gate driving circuit in a wide range. The SiC MOSFET is controllable in all switching states and stable up to 125/spl deg/C case temperature. The switching behaviour tested under conditions typical for motor drives is robust against short cuts and short time overloading.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Electrical performance of triple implanted vertical silicon carbide MOSFETs with low on-resistance\",\"authors\":\"D. Peters, P. Friedrichs, R. Schorner, H. Mitlehner, B. Weis, D. Stephani\",\"doi\":\"10.1109/ISPSD.1999.764071\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes results of 6H silicon carbide vertical power MOSFETs designed for different blocking capabilities: 600 V and 1600 V. The fabrication is based on a triple implantation technique with a lateral inversion channel. The MOSFETs are normally off and exhibit specific on-resistances of 22 and 40 m/spl Omega/cm/sup 2/, respectively. A chip area of 1 mm/sup 2/ has emerged as a suitable value in order to achieve an acceptable yield with respect to the blocking capability. A SiC MOSFET of this size can be driven up to 1 A in continuous operation. As expected for a unipolar device, short turn-on and turn-off delay times have been measured. In particular, due to a very small accumulation zone, the Miller capacitance is small in comparison to Si MOSFETs. The switching speed can be influenced by the gate driving circuit in a wide range. The SiC MOSFET is controllable in all switching states and stable up to 125/spl deg/C case temperature. The switching behaviour tested under conditions typical for motor drives is robust against short cuts and short time overloading.\",\"PeriodicalId\":352185,\"journal\":{\"name\":\"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-05-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.1999.764071\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.1999.764071","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electrical performance of triple implanted vertical silicon carbide MOSFETs with low on-resistance
This paper describes results of 6H silicon carbide vertical power MOSFETs designed for different blocking capabilities: 600 V and 1600 V. The fabrication is based on a triple implantation technique with a lateral inversion channel. The MOSFETs are normally off and exhibit specific on-resistances of 22 and 40 m/spl Omega/cm/sup 2/, respectively. A chip area of 1 mm/sup 2/ has emerged as a suitable value in order to achieve an acceptable yield with respect to the blocking capability. A SiC MOSFET of this size can be driven up to 1 A in continuous operation. As expected for a unipolar device, short turn-on and turn-off delay times have been measured. In particular, due to a very small accumulation zone, the Miller capacitance is small in comparison to Si MOSFETs. The switching speed can be influenced by the gate driving circuit in a wide range. The SiC MOSFET is controllable in all switching states and stable up to 125/spl deg/C case temperature. The switching behaviour tested under conditions typical for motor drives is robust against short cuts and short time overloading.