X-Y和z轴电容加速度计封装在超干净的密封环境

V. Hong, B. J. Lee, D. L. Christensen, D. Heinz, E. Ng, C. Ahn, Y. Yang, T. Kenny
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引用次数: 12

摘要

我们提出了第一个采用外延多晶硅封装(' epi-seal')工艺的超小型(< 1 mm2)电容性加速度计。横向(X/ y轴)和平面外(z轴)加速度计使用外延密封工艺的一种变体制造,该工艺利用封装层中定义的单独电极。横向和面外加速度计的灵敏度分别达到了10.2 fF/g和0.24 fF/g。实现了分辨率低至0.47 mg/rt-Hz,接近加速度计和现成电容测量芯片(AD7746)系统的理论布朗极限。这使得加速计,陀螺仪,压力传感器,温度计和时钟的单片机集成都在一个既定的商业制造过程中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
X-Y and Z-axis capacitive accelerometers packaged in an ultra-clean hermetic environment
We present the first ultra-miniature (<;1 mm2) capacitive accelerometers built in the epitaxial polysilicon encapsulation (`epi-seal') process. Lateral (X/Y-axis) and out-of-plane (Z-axis) accelerometers were fabricated using a variant of the epi-seal process that utilizes a separate electrode defined in the encapsulation layer. Sensitivities of up to 10.2 fF/g and 0.24 fF/g were achieved for lateral and out-of-plane accelerometers respectively. Resolution down to 0.47 mg/rt-Hz is realized, approaching the theoretical Brownian limit for a combined accelerometer and off-the-shelf capacitance-measuring chip (AD7746) system. This enables singlechip integration of accelerometers, gyroscopes, pressure sensors, thermometers, and clocks all in an established commercial manufacturing process.
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