一种新型场增强结构的掺硅高性能WOx电阻存储器

K. Chiang, E. Lai, Chao-Hung Wang, Yu-Hsuan Lin, P. Tseng, Jau-Yi Wu, Ming-Hsiu Lee, Dai-Ying Lee, Yu-Yu Lin, F. Lee, K. Hsieh, Chih-Yuan Lu
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引用次数: 0

摘要

我们开发了一种简单的结构,可以增强局部电场,从而降低WOx ReRAM的成形和SET/RESET操作电压。采用掺硅W膜进一步增加了初始电阻,提高了可靠性。TCAD仿真表明,电场增强结构提供的等效电场只有非常小的常规W插头(约10nm)才能达到。因此,我们新颖而简单的结构可以提供深度器件的优点,而无需昂贵的先进光刻技术,并且具有更大器件的性能和可靠性。此外,硅掺杂提供了一个额外的旋钮,允许电阻调谐,以优化电池和阵列的性能。1T1R存储器阵列控制良好,通过恒流复位可以可靠地实现MLC操作,其逻辑状态由累计复位脉冲持续时间决定。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Si-Doped High-Performance WOx Resistance Memory Using a Novel Field-Enhanced Structure
We developed a simple structure that can enhance the local electric field thus reduce the forming and SET/RESET operation voltage for WOx ReRAM. Si-doped W film is used to further increase the initial resistance and improve the reliability properties. TCAD simulation shows that the field enhanced structure provides an equivalent electrical field that would only be achieved by very small conventional W plug ~ 10nm in size. Thus our novel but simple structure can provide the benefit of deep scaled device without expensive advanced lithography, and with better performance and reliability of larger devices. Furthermore,Si-doping provides an additional knob that allows resistance tuning to optimize the cell and array performance. The 1T1R memory array is well controlled and MLC operation can be reliably achieved by constant current RESET with logic states determined by cumulative RESET pulse duration.
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