单片InSb电荷耦合红外成像装置

R. Thom, F. Renda, W. Parrish, T. Koch
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引用次数: 11

摘要

单片电荷耦合红外成像器件(ccirid)已经在InSb和红外探测和读出中制造出来。已经操作的ccirid是20元线性阵列,将MOS探测器的横向转移到InSb CCD移位寄存器中。20位寄存器是一个四相,表面通道,重叠门CCD。利用脂肪零(FZ)输入信号的电注入测量了电荷转移效率(CTE)。在fc= 100 kHz和77°K时,CTE≥0.995。CTE受平行边缘表面状态损失的限制,并与被测器件的表面状态密度在5×1011-至1012-cm-2- ev -1范围内相关。光电门中的电荷集成,转移到寄存器中,以及20个探测器信号的串行读出已经为InSb ccirid进行了演示。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A monolithic InSb charge-coupled infrared imaging device
Monolithic charge-coupled infrared imaging devices (CCIRIDs) have been fabricated in InSb and infrared detection and readout with the arrays demonstrated. The CCIRIDs which have been operated are 20-element linear arrays incorporating lateral transfer from MOS detectors into an InSb CCD shift register. The 20-bit register is a four-phase, surface channel, overlapping gate CCD. The charge transfer efficiency (CTE) has been measured by electrical injection of signal using the fat zero (FZ) inputs. At fc= 100 kHz and 77°K, CTE is ≥0.995 operating with a FZ. The CTE is limited by parallel-edge surface state loss and correlates with the surface state density which is in the 5×1011- to 1012-cm-2-eV-1range for the devices tested. Charge integration in the photo-gates, transfer into the register, and serial read-out of the 20 detector signals have been demonstrated for the InSb CCIRIDs.
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