铜动力金属化学镀镍过程中铜活化过程中钯铜相互扩散

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2014-06-01 DOI:10.1109/IPFA.2014.6898185

Poo Khai Yee, Wan Tatt Wai, Yong Foo Khong

{"title":"铜动力金属化学镀镍过程中铜活化过程中钯铜相互扩散","authors":"Poo Khai Yee, Wan Tatt Wai, Yong Foo Khong","doi":"10.1109/IPFA.2014.6898185","DOIUrl":null,"url":null,"abstract":"Electroless Nickel deposition on Copper metallization required a thin Palladium layer (<; 5nm) as catalyst for Copper activation purpose. By using several physical failure analysis approaches, Palladium-Copper inter-diffusion behavior was proven affected by flow rate variation of chemical solution during Copper activation process.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Palladium-copper inter-diffusion during copper activation for electroless Nickel plating process on Copper power metal\",\"authors\":\"Poo Khai Yee, Wan Tatt Wai, Yong Foo Khong\",\"doi\":\"10.1109/IPFA.2014.6898185\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Electroless Nickel deposition on Copper metallization required a thin Palladium layer (<; 5nm) as catalyst for Copper activation purpose. By using several physical failure analysis approaches, Palladium-Copper inter-diffusion behavior was proven affected by flow rate variation of chemical solution during Copper activation process.\",\"PeriodicalId\":409316,\"journal\":{\"name\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"56 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2014.6898185\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898185","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

在铜金属化上化学镀镍需要薄的钯层(<;5nm)作为铜活化催化剂。采用多种物理失效分析方法，验证了铜活化过程中钯-铜的互扩散行为受化学溶液流速变化的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Palladium-copper inter-diffusion during copper activation for electroless Nickel plating process on Copper power metal

Electroless Nickel deposition on Copper metallization required a thin Palladium layer (<; 5nm) as catalyst for Copper activation purpose. By using several physical failure analysis approaches, Palladium-Copper inter-diffusion behavior was proven affected by flow rate variation of chemical solution during Copper activation process.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

自引率

0.00%

发文量