低温下的28个FDSOI模拟值和RF值

B. K. Esfeh, M. Masselus, N. Planes, M. Haond, J. Raskin, D. Flandre, V. Kilchytska
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引用次数: 9

摘要

本文介绍了低温下28纳米FDSOI CMOS工艺的详细表征。本文首次对静电、模拟和射频性能图(FoM)进行了研究。在低温下,漏极电流、Id和最大跨导gm_max值增加了20-70%,截止频率fT增加了100 GHz。从迁移率和串联电阻效应的角度讨论了模拟FoMs和射频FoMs的温度特性。第一项研究表明,28FDSOI是未来量子比特读出电子器件的有力竞争者。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
28 FDSOI analog and RF Figures of Merit at cryogenic temperatures
This work presents a detailed characterization of 28 nm FDSOI CMOS process at cryogenic temperatures. Electrostatic, Analog and RF Figures of Merit (FoM) are studied for the first time to our best knowledge. At cryogenic temperatures, 20–70% enhancement of drain current, Id, and maximum transconductance, gm_max, values as well as up to 100 GHz increase of cut-off frequency, fT, are demonstrated. Temperature behavior of analog and RF FoMs is discussed in terms of mobility and series resistance effect. This first study suggests 28FDSOI as a good contender for future read-out electronics around qubits.
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