J. Bickel, M. Schneider-Ramelow, K.-D. Lang, R. Gesche, H. Ngo
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Platinum interconnections for harsh environment applications using atmospheric pressure sputtering
For the atmospheric pressure sputtering technology, directly structured thin- and highly conductive layers of platinum were additively deposited on Al2O3 ceramic substrate. The necessary process parameters could be identified and the layers could be contacted by using thin-wire bonding. A subsequent storage for 10 h at 500 °C shows no degeneration of the mechanical bonding properties.
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