H. Brandes, T. Hillmer, M. R. Levit, W. Corbett, N. Frost
{"title":"用于高压应用的新一代导电胶带","authors":"H. Brandes, T. Hillmer, M. R. Levit, W. Corbett, N. Frost","doi":"10.1109/ELINSL.2006.1665336","DOIUrl":null,"url":null,"abstract":"The market for modern high voltage machines requires materials with higher thermal capability. To satisfy this requirement, Von Roll and DuPont completed joint development of a new aramid-based conductive tape, which can be applied up to thermal class of 220 degC and which has improved impregnability and optimum conductivity. The material is coming without a binder and, therefore, resin compatibility problems are excluded","PeriodicalId":427638,"journal":{"name":"Conference Record of the 2006 IEEE International Symposium on Electrical Insulation","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"New generation of conductive tapes for high voltage applications\",\"authors\":\"H. Brandes, T. Hillmer, M. R. Levit, W. Corbett, N. Frost\",\"doi\":\"10.1109/ELINSL.2006.1665336\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The market for modern high voltage machines requires materials with higher thermal capability. To satisfy this requirement, Von Roll and DuPont completed joint development of a new aramid-based conductive tape, which can be applied up to thermal class of 220 degC and which has improved impregnability and optimum conductivity. The material is coming without a binder and, therefore, resin compatibility problems are excluded\",\"PeriodicalId\":427638,\"journal\":{\"name\":\"Conference Record of the 2006 IEEE International Symposium on Electrical Insulation\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-06-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Conference Record of the 2006 IEEE International Symposium on Electrical Insulation\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ELINSL.2006.1665336\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Record of the 2006 IEEE International Symposium on Electrical Insulation","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ELINSL.2006.1665336","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
New generation of conductive tapes for high voltage applications
The market for modern high voltage machines requires materials with higher thermal capability. To satisfy this requirement, Von Roll and DuPont completed joint development of a new aramid-based conductive tape, which can be applied up to thermal class of 220 degC and which has improved impregnability and optimum conductivity. The material is coming without a binder and, therefore, resin compatibility problems are excluded