CMOS光子学/spl贸易/ - SOI学习新技巧

C. Gunn
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引用次数: 17

摘要

Luxtera使用飞思卡尔半导体生产的0.13/spl mu/m SOI工艺来实现高带宽LAN, SAN,货架对货架和芯片对芯片通信的光通信能力。与新兴的电气互连标准相比,这些光收发器核心以10Gbps的速度运行,并提供优越的覆盖范围、功耗、延迟、芯片面积和可扩展性。它们与SOI CMOS电路一起在同一芯片中单片制造。因此,有史以来第一次,直接在硅晶片之间的高速光通信可以以优于传统电互连的价格/性能点完成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
CMOS photonics/spl trade/ - SOI learns a new trick
Luxtera has used Freescale Semiconductor's production 0.13/spl mu/m SOI process to implement optical communications capability for high bandwidth LAN, SAN, shelf-to-shelf and chip-to-chip communications. These optical transceiver cores operate at 10Gbps and offer superior reach, power consumption, latency, die area, and scalability compared to emerging standards for electrical interconnect. They are monolithically fabricated alongside SOI CMOS circuitry in the same die. Thus, for the first time in history, high speed optical communications directly between silicon die can be accomplished at a price/performance point superior to traditional electrical interconnect.
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