用于大批量混合技术节点生产的综合互连蚀刻工具鉴定方法

2007 International Symposium on Semiconductor Manufacturing Pub Date : 2007-10-01 DOI:10.1109/ISSM.2007.4446830

P. Frankwicz, R. Clark, K. Hayes, M. Johnson, L. Kennedy, D. Scipione, C. Viera, T. Moutinho

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引用次数: 6

摘要

该工具集的来料生产可跨越500nm至180nm的技术节点;i线到深紫外光刻胶和众多抗反射涂层(ARC)和互连金属堆叠方案。本文将讨论用于大批量混合节点金属互连蚀刻生产的多参数鉴定(MPQ)协议的方法和优点。

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Comprehensive interconnect etch tool qualification methodology for high volume mixed technology node production

Incoming production to this tool set can span technology nodes of 500nm to 180nm; I-line to deep ultraviolet photoresist and numerous anti-reflective coating (ARC) and interconnect metal stack schemes. This paper will discuss the methodology and merits of a multiple parametric qualification (MPQ) protocol for high volume mixed node metal interconnect etch production.

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来源期刊

2007 International Symposium on Semiconductor Manufacturing

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