原子层沉积ZrO2-HfO2薄膜的电阻开关特性

O. G. Ossorio, S. Dueñas, H. Castán, A. Tamm, K. Kalam, H. Seemen, K. Kukli
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引用次数: 2

摘要

本文研究了ZrO2-HfO2基金属-绝缘体-金属(MIM)器件的电阻开关特性。我们观察到不同的中间状态和总体上良好的重复性,用直流和交流参数表示。采用原子层沉积法(ALD)在平面Si(100)和TiN衬底上交替施加一定量的二元氧化物生长循环,生长出由ZrO2和Hf02组成的混合薄膜。实验结果表明,富氧化锆薄膜比纯氧化锆或富氧化铪薄膜具有更好的电阻开关性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Resistive Switching Properties of Atomic Layer Deposited ZrO2-HfO2 Thin Films
In this work we study the resistive switching properties of ZrO2-HfO2 based Metal-Insulator-Metal (MIM) devices. We observed different intermediate states and an overall good repetitiveness, expressed in terms of DC and AC parameters. Thin films consisting of mixtures of ZrO2 and Hf02 were grown by atomic layer deposition (ALD) on planar Si(100) and TiN substrates by alternately applying certain amounts of constituent binary oxide growth cycles. The experimental results revealed that zirconium oxide rich films provide better resistive switching behavior than pure zirconium oxide or hafnium oxide rich layers.
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