直接键合晶圆级3D集成

2010 IEEE International Conference on Integrated Circuit Design and Technology Pub Date : 2010-06-02 DOI:10.1109/ICICDT.2010.5510276

L. Di Cioccio, I. Radu, P. Gueguen, M. Sadaka

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引用次数: 12

摘要

3D集成是一个有前途且快速发展的领域，它解决了摩尔定律的融合问题，并且不仅仅是摩尔定律，3D集成提供了更高的性能、更高的密度、更高的功能、更小的外形尺寸和潜在的成本降低。随着这一新兴领域的出现，需要新的和改进的技术来应对相关的制造挑战。本文描述了一些描述氧化物对氧化物和金属对金属键合的三维构建块

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Direct bonding for wafer level 3D integration

3D integration is a promising and fast growing field that addresses the convergence of Moore's Law and more than Moore. 3D integration offers higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction. With this emerging field, new and improved technologies will be necessary to meet the associated manufacturing challenges. This paper describes some 3D building blocks describing oxide to oxide and metal to metal bonding with alignment

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2010 IEEE International Conference on Integrated Circuit Design and Technology

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