电源模块在电源循环过程中的热阻抗谱

2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs Pub Date : 2011-05-23 DOI:10.1109/ISPSD.2011.5890841

Alexander Henlser, D. Wingert, C. Herold, J. Lutz, M. Thoben

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引用次数: 14

摘要

所提出的功率模块热阻抗谱分析方法大大简化了功率模块的故障分析。它可以在线观察冷却路径内的退化，并提供有关失效机制的详细信息。通过对Zth参数的观测，检测了功率模块内部某一层的退化情况。将几个试验结果与扫描声显微镜的分析结果进行了比较。

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Thermal impedance spectroscopy of power modules during power cycling

The presented thermal impedance spectroscopy of power modules simplifies significantly the failure analysis of power modules. It enables online observation of degradation within the cooling path with detailed information about failure mechanisms. The degradation of certain layer within the power module is detected by observation of Zth parameters. Several tests results are compared with analysis of the scanning acoustic microscope.

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2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs

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