最新的微尺度半导体封装XRF涂层分析设备

Matt Kreiner, M. Ohgaki, K. Shinohara
{"title":"最新的微尺度半导体封装XRF涂层分析设备","authors":"Matt Kreiner, M. Ohgaki, K. Shinohara","doi":"10.23919/IWLPC.2019.8914056","DOIUrl":null,"url":null,"abstract":"X-ray fluorescence (XRF) analysis is a widely used technique to measure plating thickness. Its main advantage resides in allowing simultaneous, non-destructive analysis of multilayered plated parts. The miniaturization and increasing complexity of electronic devices proliferated by advancements in smartphone functionality continues with the rise of microelectromechanical systems (MEMS). Consequently, the electronic components and features for these devices are becoming as miniscule as ever. In order to maintain the necessary quality of these components, the measuring and control of the plating thickness and composition is critical. For this application, an XRF plating thickness analyzer capable of high accuracy measurement in small areas is essential. Utilizing the latest X-ray focusing polycapillary technology with a high-sensitivity detector, modern XRF systems deliver high-precision measurements of nanometer-scale plating. The beam diameter of less than $20\\ \\mu \\mathrm{m}$ (full width at half maximum, FWHM) not only allows plating thickness measurements, but also composition analysis, useful for solder bumps. This allows for an outstanding measurement repeatability, achieving precision of 1% RSD for gold plating at 100 Å. Furthermore, the levels of irradiated energy are lower than those utilized in wavelength dispersive techniques (WDXRF), thus considerably reducing the potential damage to the sample. This paper discusses XRF as an analytical technique for determining the thickness of plated or coated layers applied to a substrate. The effects of layer structure and properties on multilayer XRF thickness measurements are investigated.","PeriodicalId":373797,"journal":{"name":"2019 International Wafer Level Packaging Conference (IWLPC)","volume":"679 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"The Latest in XRF Coatings Analysis Equipment for Micro-Scale Semiconductor Packaging\",\"authors\":\"Matt Kreiner, M. Ohgaki, K. Shinohara\",\"doi\":\"10.23919/IWLPC.2019.8914056\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"X-ray fluorescence (XRF) analysis is a widely used technique to measure plating thickness. Its main advantage resides in allowing simultaneous, non-destructive analysis of multilayered plated parts. The miniaturization and increasing complexity of electronic devices proliferated by advancements in smartphone functionality continues with the rise of microelectromechanical systems (MEMS). Consequently, the electronic components and features for these devices are becoming as miniscule as ever. In order to maintain the necessary quality of these components, the measuring and control of the plating thickness and composition is critical. For this application, an XRF plating thickness analyzer capable of high accuracy measurement in small areas is essential. Utilizing the latest X-ray focusing polycapillary technology with a high-sensitivity detector, modern XRF systems deliver high-precision measurements of nanometer-scale plating. The beam diameter of less than $20\\\\ \\\\mu \\\\mathrm{m}$ (full width at half maximum, FWHM) not only allows plating thickness measurements, but also composition analysis, useful for solder bumps. This allows for an outstanding measurement repeatability, achieving precision of 1% RSD for gold plating at 100 Å. Furthermore, the levels of irradiated energy are lower than those utilized in wavelength dispersive techniques (WDXRF), thus considerably reducing the potential damage to the sample. This paper discusses XRF as an analytical technique for determining the thickness of plated or coated layers applied to a substrate. The effects of layer structure and properties on multilayer XRF thickness measurements are investigated.\",\"PeriodicalId\":373797,\"journal\":{\"name\":\"2019 International Wafer Level Packaging Conference (IWLPC)\",\"volume\":\"679 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International Wafer Level Packaging Conference (IWLPC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/IWLPC.2019.8914056\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Wafer Level Packaging Conference (IWLPC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/IWLPC.2019.8914056","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

x射线荧光(XRF)分析是一种广泛应用于镀层厚度测量的技术。它的主要优点在于允许对多层镀件同时进行无损分析。随着智能手机功能的进步,随着微机电系统(MEMS)的兴起,电子设备的小型化和复杂性不断增加。因此,这些设备的电子元件和功能变得越来越小。为了保持这些组件的必要质量,镀层厚度和成分的测量和控制是至关重要的。对于这种应用,能够在小范围内进行高精度测量的XRF镀层厚度分析仪是必不可少的。利用最新的x射线聚焦多毛细技术和高灵敏度探测器,现代XRF系统提供纳米级电镀的高精度测量。光束直径小于$20\ \mu \mathrm{m}$(最大半宽,FWHM)不仅可以测量镀层厚度,还可以进行成分分析,对焊料凸起有用。这可以实现出色的测量重复性,在100 Å下实现1% RSD的镀金精度。此外,辐照能量水平低于波长色散技术(WDXRF)中使用的水平,从而大大减少了对样品的潜在损害。本文讨论了XRF作为一种分析技术来确定镀层或涂层的厚度。研究了层的结构和性能对多层XRF测厚的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Latest in XRF Coatings Analysis Equipment for Micro-Scale Semiconductor Packaging
X-ray fluorescence (XRF) analysis is a widely used technique to measure plating thickness. Its main advantage resides in allowing simultaneous, non-destructive analysis of multilayered plated parts. The miniaturization and increasing complexity of electronic devices proliferated by advancements in smartphone functionality continues with the rise of microelectromechanical systems (MEMS). Consequently, the electronic components and features for these devices are becoming as miniscule as ever. In order to maintain the necessary quality of these components, the measuring and control of the plating thickness and composition is critical. For this application, an XRF plating thickness analyzer capable of high accuracy measurement in small areas is essential. Utilizing the latest X-ray focusing polycapillary technology with a high-sensitivity detector, modern XRF systems deliver high-precision measurements of nanometer-scale plating. The beam diameter of less than $20\ \mu \mathrm{m}$ (full width at half maximum, FWHM) not only allows plating thickness measurements, but also composition analysis, useful for solder bumps. This allows for an outstanding measurement repeatability, achieving precision of 1% RSD for gold plating at 100 Å. Furthermore, the levels of irradiated energy are lower than those utilized in wavelength dispersive techniques (WDXRF), thus considerably reducing the potential damage to the sample. This paper discusses XRF as an analytical technique for determining the thickness of plated or coated layers applied to a substrate. The effects of layer structure and properties on multilayer XRF thickness measurements are investigated.
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