R. Gaska, M. Gaevski, J. Deng, R. Jain, G. Simin, M. Shur
{"title":"新颖的AlInN/GaN集成电路工作温度高达500°C","authors":"R. Gaska, M. Gaevski, J. Deng, R. Jain, G. Simin, M. Shur","doi":"10.1109/ESSDERC.2014.6948778","DOIUrl":null,"url":null,"abstract":"High-temperature technology platform has been developed based on AlInN/GaN heterostructures. High electron concentration in 2DEG channel of AlInN/GaN devices is remarkably stable over a broad temperature range, enabling device operation above 500 °C. The developed IC technology is based on three key elements: (1) exceptional quality AlInN/GaN heterostructure with very high carrier concentration and mobility that enables IC fast operation in a broad temperature range; (2) heterostructure field effect transistor approach that provides fully planar IC structure which is easy to scale and to combine with the other high temperature electronic components; (3) fabrication advancements including novel metallization scheme and high-k passivation/gate dielectrics, specifically developed for high temperature operation. The feasibility of the technology was demonstrated by fabrication and testing inverter and differential amplifier ICs using AlInN/GaN heterostructures. At temperature exceeding 500°C, the developed ICs show stable performance with unit-gain bandwidth above 1 MHz and internal response time 45 ns*.","PeriodicalId":262652,"journal":{"name":"2014 44th European Solid State Device Research Conference (ESSDERC)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"26","resultStr":"{\"title\":\"Novel AlInN/GaN integrated circuits operating up to 500 °C\",\"authors\":\"R. Gaska, M. Gaevski, J. Deng, R. Jain, G. Simin, M. Shur\",\"doi\":\"10.1109/ESSDERC.2014.6948778\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High-temperature technology platform has been developed based on AlInN/GaN heterostructures. High electron concentration in 2DEG channel of AlInN/GaN devices is remarkably stable over a broad temperature range, enabling device operation above 500 °C. The developed IC technology is based on three key elements: (1) exceptional quality AlInN/GaN heterostructure with very high carrier concentration and mobility that enables IC fast operation in a broad temperature range; (2) heterostructure field effect transistor approach that provides fully planar IC structure which is easy to scale and to combine with the other high temperature electronic components; (3) fabrication advancements including novel metallization scheme and high-k passivation/gate dielectrics, specifically developed for high temperature operation. The feasibility of the technology was demonstrated by fabrication and testing inverter and differential amplifier ICs using AlInN/GaN heterostructures. At temperature exceeding 500°C, the developed ICs show stable performance with unit-gain bandwidth above 1 MHz and internal response time 45 ns*.\",\"PeriodicalId\":262652,\"journal\":{\"name\":\"2014 44th European Solid State Device Research Conference (ESSDERC)\",\"volume\":\"48 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"26\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 44th European Solid State Device Research Conference (ESSDERC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSDERC.2014.6948778\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 44th European Solid State Device Research Conference (ESSDERC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDERC.2014.6948778","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Novel AlInN/GaN integrated circuits operating up to 500 °C
High-temperature technology platform has been developed based on AlInN/GaN heterostructures. High electron concentration in 2DEG channel of AlInN/GaN devices is remarkably stable over a broad temperature range, enabling device operation above 500 °C. The developed IC technology is based on three key elements: (1) exceptional quality AlInN/GaN heterostructure with very high carrier concentration and mobility that enables IC fast operation in a broad temperature range; (2) heterostructure field effect transistor approach that provides fully planar IC structure which is easy to scale and to combine with the other high temperature electronic components; (3) fabrication advancements including novel metallization scheme and high-k passivation/gate dielectrics, specifically developed for high temperature operation. The feasibility of the technology was demonstrated by fabrication and testing inverter and differential amplifier ICs using AlInN/GaN heterostructures. At temperature exceeding 500°C, the developed ICs show stable performance with unit-gain bandwidth above 1 MHz and internal response time 45 ns*.