新颖的AlInN/GaN集成电路工作温度高达500°C

R. Gaska, M. Gaevski, J. Deng, R. Jain, G. Simin, M. Shur
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引用次数: 26

摘要

开发了基于AlInN/GaN异质结构的高温技术平台。AlInN/GaN器件在2g通道中的高电子浓度在宽温度范围内非常稳定,使器件能够在500°C以上工作。开发的集成电路技术基于三个关键要素:(1)具有极高载流子浓度和迁移率的高质量alin /GaN异质结构,使集成电路能够在宽温度范围内快速运行;(2)异质结构场效应晶体管方法,提供全平面的集成电路结构,易于缩放和与其他高温电子元件结合;(3)制造方面的进步,包括新的金属化方案和高k钝化/栅极电介质,专门用于高温操作。利用AlInN/GaN异质结构制作和测试了逆变器和差分放大器集成电路,证明了该技术的可行性。在温度超过500℃时,所研制的集成电路表现出稳定的性能,单位增益带宽在1 MHz以上,内部响应时间为45 ns*。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Novel AlInN/GaN integrated circuits operating up to 500 °C
High-temperature technology platform has been developed based on AlInN/GaN heterostructures. High electron concentration in 2DEG channel of AlInN/GaN devices is remarkably stable over a broad temperature range, enabling device operation above 500 °C. The developed IC technology is based on three key elements: (1) exceptional quality AlInN/GaN heterostructure with very high carrier concentration and mobility that enables IC fast operation in a broad temperature range; (2) heterostructure field effect transistor approach that provides fully planar IC structure which is easy to scale and to combine with the other high temperature electronic components; (3) fabrication advancements including novel metallization scheme and high-k passivation/gate dielectrics, specifically developed for high temperature operation. The feasibility of the technology was demonstrated by fabrication and testing inverter and differential amplifier ICs using AlInN/GaN heterostructures. At temperature exceeding 500°C, the developed ICs show stable performance with unit-gain bandwidth above 1 MHz and internal response time 45 ns*.
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