用于高温应用的BiCMOS超声前端信号处理器

Proceedings of the 31st European Solid-State Circuits Conference, 2005. ESSCIRC 2005. Pub Date : 2005-12-05 DOI:10.1109/ESSCIR.2005.1541616

O. Vermesan, L. Blystad, R. Bahr, M. Hjelstuen, L. Beneteau, B. Froelich

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引用次数: 1

摘要

介绍了一种以0.6/spl μ m BiCMOS HotASIC/spl reg/技术实现超声前端接收器的混合信号ASIC。ASIC包括一个低噪声放大器(LNA)，一个可编程增益放大器(PGA)，一个输出差分放大器(ODA)，一个二阶σ δ调制器(SDM)，是文献报道的高温超声应用中最紧凑的系统。该电路具有可编程增益，设计用于测量来自超声波换能器的信号响应(200kHz至700kHz)。在48MHz时钟频率和200/spl度/C下，单个5V电源的功耗为85mW。芯片的模面积为5.52 mm/sup 2/。

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A BiCMOS ultrasound front end signal processor for high temperature applications

A mixed signal ASIC that implements an ultrasound front end receiver in a 0.6/spl mu/m BiCMOS HotASIC/spl reg/ technology is described. The ASIC includes a low noise amplifier (LNA), a programmable gain amplifier (PGA), an output differential amplifier (ODA), a second order sigma delta modulator (SDM) and is the most compact system for high temperature ultrasound applications reported in literature. The circuit has a programmable gain and is designed for measuring the signal response (200kHz to 700kHz) from an ultrasound transducer. At 48MHz clock frequency and 200/spl deg/C the power consumption is 85mW from a single 5V supply. The die area of the chip is 5.52 mm/sup 2/.

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Proceedings of the 31st European Solid-State Circuits Conference, 2005. ESSCIRC 2005.

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