低温连接技术对硅模具应力状态的影响

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI:10.1109/EUROSIME.2013.6529945

T. Herboth, M. Guenther, R. Zeiser, J. Wilde

{"title":"低温连接技术对硅模具应力状态的影响","authors":"T. Herboth, M. Guenther, R. Zeiser, J. Wilde","doi":"10.1109/EUROSIME.2013.6529945","DOIUrl":null,"url":null,"abstract":"The aim of this study was to analyse the stress state in silicon dies joined by Low Temperature Joining Technology (LTJT) based on measurements and simulation results. The focus was to establish a method to determine the initial stress state and stress-free temperature in a silicon die attached to a copper substrate after the joining process. An approach to analyse the evolution of the stress state after sintering and during thermal cycling was developed.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Investigation of stress states in silicon dies induced by the Low Temperature Joining Technology\",\"authors\":\"T. Herboth, M. Guenther, R. Zeiser, J. Wilde\",\"doi\":\"10.1109/EUROSIME.2013.6529945\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The aim of this study was to analyse the stress state in silicon dies joined by Low Temperature Joining Technology (LTJT) based on measurements and simulation results. The focus was to establish a method to determine the initial stress state and stress-free temperature in a silicon die attached to a copper substrate after the joining process. An approach to analyse the evolution of the stress state after sintering and during thermal cycling was developed.\",\"PeriodicalId\":270532,\"journal\":{\"name\":\"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"38 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-04-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2013.6529945\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2013.6529945","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

本研究的目的是在测量和模拟结果的基础上分析低温连接技术(LTJT)连接硅模具的应力状态。重点是建立一种方法来确定连接过程后附着在铜衬底上的硅模的初始应力状态和无应力温度。提出了一种分析烧结后和热循环过程中应力状态演变的方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Investigation of stress states in silicon dies induced by the Low Temperature Joining Technology

The aim of this study was to analyse the stress state in silicon dies joined by Low Temperature Joining Technology (LTJT) based on measurements and simulation results. The focus was to establish a method to determine the initial stress state and stress-free temperature in a silicon die attached to a copper substrate after the joining process. An approach to analyse the evolution of the stress state after sintering and during thermal cycling was developed.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

自引率

0.00%

发文量