温度循环载荷作用下倒装片板上封装焊点疲劳和蠕变的热力学分析

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI:10.1109/ECTC.1998.678811

J. Pang, T. Tan, S. Sitaraman

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引用次数: 51

摘要

对采用下填充封装的板上倒装芯片(FCOB)封装进行了热机械应力分析。在典型的-55 ~ 125℃温度循环加载条件下，建立了焊点的疲劳和蠕变响应模型，并对两种温度循环加载模型进行了研究。采用二维平面应变有限元模型对FCOB包进行了分析。模拟了温度循环条件下焊料的弹塑性和蠕变变形行为，得到了焊料的应力和应变结果。有限元应变结果用于疲劳寿命预测模型。

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Thermo-mechanical analysis of solder joint fatigue and creep in a flip chip on board package subjected to temperature cycling loading

Thermo-mechanical stress analysis was conducted on a flip-chip-on-board (FCOB) package with underfill encapsulation. The solder joint fatigue and creep deformation response were modeled for a typical temperature cycling loading of -55 to 125 C. Two temperature cycling loading models with and without the curing part of the temperature history for the encapsulation process were investigated. Two-dimensional plane-strain finite element models of the FCOB package were employed. Elasto-plastic and creep deformation behavior of solder was simulated under the temperature cycling conditions to obtain the stress and strain results. The finite element strain results were used in fatigue life prediction models.

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1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)

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