线路板中曲线延迟的研究

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI:10.1109/EPEP.1999.819224

B. Rubin, B. Singh

{"title":"线路板中曲线延迟的研究","authors":"B. Rubin, B. Singh","doi":"10.1109/EPEP.1999.819224","DOIUrl":null,"url":null,"abstract":"A full-wave electromagnetic analysis using the moment method was performed on a set of meander lines located in a circuit board to determine the effect of meander pitch on delay. Detailed sensitivity studies performed on gridding, skin-effect models, and frequency content confirm the accuracy of these results.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"80","resultStr":"{\"title\":\"Study of meander line delay in circuit boards\",\"authors\":\"B. Rubin, B. Singh\",\"doi\":\"10.1109/EPEP.1999.819224\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A full-wave electromagnetic analysis using the moment method was performed on a set of meander lines located in a circuit board to determine the effect of meander pitch on delay. Detailed sensitivity studies performed on gridding, skin-effect models, and frequency content confirm the accuracy of these results.\",\"PeriodicalId\":299335,\"journal\":{\"name\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"80\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1999.819224\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819224","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 80

摘要

利用矩量法对线路板上的一组曲线进行了全波电磁分析，确定了曲线间距对延迟的影响。对网格、皮肤效应模型和频率内容进行的详细敏感性研究证实了这些结果的准确性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Study of meander line delay in circuit boards

A full-wave electromagnetic analysis using the moment method was performed on a set of meander lines located in a circuit board to determine the effect of meander pitch on delay. Detailed sensitivity studies performed on gridding, skin-effect models, and frequency content confirm the accuracy of these results.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

自引率

0.00%

发文量