基于制造参数变化的雪崩光电二极管的比较研究

V. Vani, C. Geetha, H. Archana
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引用次数: 0

摘要

平面InP/InGaAsP雪崩光电二极管是光通信接收模块中的重要器件。这些器件为高速运行提供了优异的性能,但其性能最终受到制造参数变化的很大影响。本文研究了制造工艺参数的变化对InP/InGaAsP雪崩光电二极管性能的影响。设计、模拟和测试了雪崩光电二极管在倍增层、吸收层和载流子层等光电二极管各层厚度等制造参数变化下的对比研究。结果包括对每个设计器件的击穿特性、增益、光谱响应和量子效率等器件特性的验证。同时也说明了增透涂层的重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparative study of Avalanche Photodiode based on manufacturing parameter variations
Planar InP/InGaAsP Avalanche Photodiode are important components in the optical communication receiver modules. These devices provide excellent performance for high-speed operations, but their performance is eventually affected by the manufacturing parameter variations considerably. In this paper, an effort has been made to study the effects on theperformance of InP/InGaAsP Avalanche Photodiode due to the variations in the manufacturing parameters. A comparative study of Avalanche Photodiodes with manufacturing parameter variations such as thickness of various layers of photodiode like multiplication layer, absorption layer and carrier layer has been designed, simulated and tested. The results involve verification of device characteristics like breakdown characteristics, gain, spectral response and Quantum efficiency on each of the devices designed. Also, the significance of Anti-reflection coating has been shown in the study.
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