低温共烧陶瓷工艺下三维微波器件的设计与研究

R. Zimin, S.D. Logvinenko, A. A. Kishchinskiy, B. Krylov, N. V. Frolova
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引用次数: 0

摘要

本报告描述了LTCC技术所带来的机遇,它的实现及其在3D微波器件制造中的实际应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design and investigation of 3D microwave devices manufactured under the low-temperature co-fired ceramic process
This report describes the opportunities presented by the LTCC technology, its implementation and its practical application in the manufacture of 3D microwave devices.
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