移动通信设备的设计挑战

C. Kutter
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引用次数: 3

摘要

只提供摘要形式。用于移动设备的系统芯片(SoC),如GSM/EDGE/UMTS,具有强烈的冲突要求。一方面,随着每一个新标准的推出,对处理性能的要求也在稳步提高,另一方面,又要求极低的功耗。性能需求变化很大,取决于手机模式和活动,如待机模式、通话模式和高性能应用模式,如视频处理和游戏。随着新电信标准的不断发展,硅技术也沿着收缩路径发展。在DSM技术中,物理结构的缩放,尤其是栅极厚度的缩放,会导致更大的泄漏。这种收缩伴随着电源电压的进一步降低,这有助于减少动态功耗,但也降低了性能改进的杠杆作用。为了减少泄漏并达到设计项目的目标,必须通过集成技术、库、设计工具和设计流程来定义和实施新的低功耗措施。近年来,为了解决静态泄漏功耗和动态有功功耗问题,开发了几种低功耗特性。这些功能,或者它们的组合,可以根据SoC在不同模式下的动态变化的性能需求进行定制,这意味着不同的用例
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design Challenges for Mobile Communication Devices
Summary form only given. System on chips (SoC) for mobile devices, such as GSM/EDGE/UMTS, have strongly conflicting requirements. On one hand the demand for processing performance is steadily increasing with every new standard and on the other hand extremely low power dissipation is demanded. The performance demands vary strongly, depending on the phone modes and activities e.g. stand-by mode vs. talk mode vs. high performance application modes such as video processing and gaming. Next to the development of new telecommunication standards the silicon technologies develop according to the shrink path. Scaling of physical structures, especially the gate thickness, induces larger leakage in DSM technologies. The shrink is accompanied with a further reduction of supply voltage that helps to reduce the dynamic power dissipation but also reduces the leverage of performance improvement. To reduce the leakage and to reach the targets of design projects new low power measures have to be defined and implemented by integration into technology, libraries, design tools, and the design flow. In recent years several low power features have been developed to address both the static leakage power consumption and the dynamic active power consumption. These features, or a combination of them, can be tailored to dynamically varying performance needs of the SoC in different modes meaning different use cases
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