先进的湿式清洗采用新型喷嘴和功能超纯水在下一代的FPD/LSI制造

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI:10.1109/ISSM.2000.993680

Ken-ichi Mitsumori, H. Nobuaki, N. Takahashi, T. Imaoka, T. Ohmi

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引用次数: 4

摘要

先进的湿式清洗方法涉及超声波流体进料喷嘴，用于在制造LCD或ULSI过程中从基板表面去除污染物。在这种方法中，进料和出料清洗液与周围空气之间的压力是平衡的。这种平衡导致给料足够厚度的清洁溶液，以去除基材上的颗粒，并排出废溶液和去除的颗粒。该方法的清洗溶液消耗量小于LCD制造中常用的超声波传统淋浴式喷嘴的1/10。我们将这种喷嘴命名为“平衡推挽式喷嘴”(bpp -喷嘴)。超声波和氢溶超纯水结合的bpp喷嘴可以去除硅片清洗中3万以上至100左右的PSL颗粒。

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Advanced wet cleaning using novel nozzle and functional ultrapure water in next generation FPD/LSI manufacturing

The advanced wet cleaning method relates to the fluid feed nozzle with ultrasonics that is employed for removing contaminants from the surfaces of the substrates during processes for manufacturing LCD or ULSI. In this method, the pressure among feeding and discharging cleaning solution and ambient air is balanced. This balance causes to feed adequate thickness of cleaning solution to remove particles from the substrate and to discharge waste solution and removed particles. The cleaning solution consumption of this method is less than 1/10 of conventional shower type nozzle with ultrasonic that has been popular in LCD fabrications. We named the nozzle using this method "balanced push-pull nozzle" (BPP-nozzle). The BPP-nozzle with ultrasonics and hydrogen-dissolved ultrapure water can remove PSL particles from above 30000 to about 100 in the Si-wafer cleaning.

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Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)

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