功率IC封装用瞬态热阻抗测试仪

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI:10.1109/ECTC.1993.346715

V. Patel, W.C. Mak, B. Rice, L. Feinstein

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引用次数: 0

摘要

介绍了一种瞬态热阻抗测试仪的设计及其一般性能。对几种功率IC封装进行了瞬态温度测量。给出了该封装在重复脉冲和复杂功率脉冲作用下的瞬态响应。测试芯片上的温度测量结果与瞬态热有限元分析结果进行了比较。讨论了测量延迟时间对结温测量的影响。

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Transient thermal impedance tester for power IC packages

A transient thermal impedance tester design and its general capabilities are presented. Transient temperature measurements on several power IC packages are obtained. Transient responses of the package subjected to repetitive pulses and to a complex transient power pulse are presented. Temperature measurements on a test chip are compared with the solution as obtained from transient thermal finite element analysis. The effects of measurement delay time on junction temperature measurement are discussed.<>

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Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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