用于射频应用的纯GaN铸造0.25µm HEMT技术

M. Weng, Che-Kai Lin, Jhih-Han Du, Wei-Chou Wang, Wen-Kai Wang, W. Wohlmuth
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引用次数: 8

摘要

本文介绍了一种新的短栅长0.25μm GaN HEMT技术的发展,重点介绍了制备、工艺控制、射频特性和直流可靠性。我们的纯晶圆代工服务支持离散和射频应用,具有详细的规格和晶圆验收测试。通过对S-到x波段的负载-拉力测量和直流可靠性的分析,设计人员可以创建使用高达28V电源电压的应用程序,功率密度为4W/mm, PAE为45%,基于无谐波终端的连续波片上测量,在10GHz下实现15dB的大信号线性增益。在1%占空比、2.5μsec脉冲条件下,获得了>5W/mm的改进功率密度、57.3%的PAE和20.1dB的s波段线性增益。重点介绍了垂直起降和垂直起降的可靠性性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Pure Play GaN Foundry 0.25µm HEMT Technology for RF Applications
This paper presents the development of a newly available short gate length 0.25μm GaN HEMT technology and focuses on fabrication, process control, RF characterization and DC reliability. Our pure play Foundry services support discrete and RF applications with detailed specifications and wafer acceptance tests. The analysis of load-pull measurements of S- through X-band and DC reliability allow designers to create applications utilizing supply voltages up to 28V, with power density of 4W/mm, PAE of 45%, and large signal linear gain of 15dB at 10GHz based on continuous-wave on-wafer measurements without harmonic terminations. Improved power density of >5W/mm, PAE of 57.3% and linear gain of 20.1dB at S-band are measured under pulsed conditions using a 2.5μsec pulse at 1% duty cycle. Reliability performances focused on HTOL and HTRB are presented.
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