{"title":"利用多维模型约简技术分析传输线电路","authors":"P. Gunupudi, R. Khazaka, Michel S. Nakhla","doi":"10.1109/EPEP.2001.967607","DOIUrl":null,"url":null,"abstract":"This paper presents a new technique to reduce the order of transmission line circuits simultaneously with respect to multiple parameters. The reduction is based on multi-dimensional congruence transformation. The proposed algorithm provides efficient means to estimate the response of large distributed circuits simultaneously as a function of frequency and other design parameters.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"160 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"69","resultStr":"{\"title\":\"Analysis of transmission line circuits using multi-dimensional model reduction techniques\",\"authors\":\"P. Gunupudi, R. Khazaka, Michel S. Nakhla\",\"doi\":\"10.1109/EPEP.2001.967607\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a new technique to reduce the order of transmission line circuits simultaneously with respect to multiple parameters. The reduction is based on multi-dimensional congruence transformation. The proposed algorithm provides efficient means to estimate the response of large distributed circuits simultaneously as a function of frequency and other design parameters.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"160 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"69\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967607\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967607","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Analysis of transmission line circuits using multi-dimensional model reduction techniques
This paper presents a new technique to reduce the order of transmission line circuits simultaneously with respect to multiple parameters. The reduction is based on multi-dimensional congruence transformation. The proposed algorithm provides efficient means to estimate the response of large distributed circuits simultaneously as a function of frequency and other design parameters.