K. Kohama, Kazuhiro Ito, K. Mori, K. Maekawa, Y. Shirai, M. Murakami
{"title":"利用卢瑟福后向散射光谱法分析Cu(Ti)/介电层样品中自形成富钛界面层的生长","authors":"K. Kohama, Kazuhiro Ito, K. Mori, K. Maekawa, Y. Shirai, M. Murakami","doi":"10.1109/IITC.2009.5090372","DOIUrl":null,"url":null,"abstract":"For systematic investigation of growth of the Ti-rich interface layers in the annealed Cu(Ti)/dielectric-layer, the RBS technique was employed. Growth behavior observed in RBS was similar to that in TEM. Thus, the RBS technique is indicated to be an appropriate method for the growth analysis of the Ti-rich interface layers.","PeriodicalId":301012,"journal":{"name":"2009 IEEE International Interconnect Technology Conference","volume":"1155 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Growth analysis of self-formed Ti-rich interface layers in Cu(Ti)/dielectric-layer samples using Rutherford Backscattering Spectrometry\",\"authors\":\"K. Kohama, Kazuhiro Ito, K. Mori, K. Maekawa, Y. Shirai, M. Murakami\",\"doi\":\"10.1109/IITC.2009.5090372\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"For systematic investigation of growth of the Ti-rich interface layers in the annealed Cu(Ti)/dielectric-layer, the RBS technique was employed. Growth behavior observed in RBS was similar to that in TEM. Thus, the RBS technique is indicated to be an appropriate method for the growth analysis of the Ti-rich interface layers.\",\"PeriodicalId\":301012,\"journal\":{\"name\":\"2009 IEEE International Interconnect Technology Conference\",\"volume\":\"1155 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE International Interconnect Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2009.5090372\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE International Interconnect Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2009.5090372","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Growth analysis of self-formed Ti-rich interface layers in Cu(Ti)/dielectric-layer samples using Rutherford Backscattering Spectrometry
For systematic investigation of growth of the Ti-rich interface layers in the annealed Cu(Ti)/dielectric-layer, the RBS technique was employed. Growth behavior observed in RBS was similar to that in TEM. Thus, the RBS technique is indicated to be an appropriate method for the growth analysis of the Ti-rich interface layers.