ULSI可制造性设计:一种良率提高方法

A. Tyagi, M. Bayoumi
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引用次数: 3

摘要

提高产量是半导体工业的一个重要目标。随着特征尺寸的减小和芯片面积的增加,芯片上的“功能”硅的数量太昂贵,以至于在发生短路和开路故障时无法丢弃。因此,设计出对故障具有高容忍度的芯片,对半导体行业的盈利制造有着巨大的希望。在本文中,我们提出了一种在版图合成布线阶段提高集成电路成品率的算法。重点是详细的路由。该算法减少了由于二维点状缺陷引起的短路的布局临界面积。临界面积的减少在水平和垂直层都可以实现,而不会对净长度或通道密度造成任何影响。结果表明,该算法的应用使产率提高了15-25%
本文章由计算机程序翻译,如有差异,请以英文原文为准。
ULSI design-for-manufacturability: a yield enhancement approach
Yield enhancement is a quintessential objective of the semiconductor industry. With diminishing feature size and increasing chip area, the amount of “functional” silicon on a chip is too expensive to discard in the event of short- and open-circuit faults. Designing chips with high tolerance against faults, therefore, holds great promise for profitable manufacturing in the semiconductor industry. In this paper, we present an algorithm for integrated circuit yield enhancement in the routing phase of layout synthesis. The focus is on detailed routing. The proposed algorithm reduces layout critical area for short circuits due to two-dimensional spot defects. Critical area reduction is achieved in both horizontal and vertical layers without any penalties on net length or channel density. Results show yield improvement of 15-25% from the application of the proposed algorithms
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