个人计算机应用中单芯片和多芯片封装的性能比较

M. Cases
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摘要

与卡上的单芯片模块相比,多芯片模块(MCM)封装在性能和信号质量方面有相当大的改进。由于减少了时钟偏差和失真,它可以支持40-45%的更快时钟速率。由于减少了电容负载,减少了有效飞行时间延迟,缩短了芯片互连距离,因此净延迟提高了40-45%。MCM包显示,由于减少了有效载荷,特定净横截面的信号质量得到改善,并且系统控制更好。它也产生更好的电气特性公差
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Performance comparison of single- and multiple-chip packages in a personal computer application
The multi-chip module (MCM) package shows considerable improvement in performance and signal quality as compared to single-chip modules on cards. It can support 40-45% faster clock rates due to reduced clock skews and distortions. It also yields 40-45% better net delays due to reduced capacitance loading, reduced effective time-of-flight delays, and shorter chip interconnect distances. The MCM package shows signal quality improvements for specific net cross sections due to reduced effective loadings, and a better controlled system. It also yields better electrical characteristic tolerances.<>
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