C. Edwards, Aditya Kumar, Alex Vaske, Nathan McDaniel, Dipali Pradhan, Debashis Panda
{"title":"使用先进计算机视觉和机器学习的实时自动插座检测:DI:缺陷检测和减少","authors":"C. Edwards, Aditya Kumar, Alex Vaske, Nathan McDaniel, Dipali Pradhan, Debashis Panda","doi":"10.1109/asmc54647.2022.9792494","DOIUrl":null,"url":null,"abstract":"Our test tools pick and place units into sockets for electrical testing. Defects or loose debris accumulated inside the test sockets will likely damage each subsequent unit being tested until the issue is detected and the defective socket is repaired or replaced. To resolve this critical issue, we equipped each pick-and-place arm with a new machine vision system designed to fit inside the existing tool. The limited footprint constraints required a highly compact imaging system which resulted in a variety of image artifacts, creating several unique challenges for the inspection system. We developed an inspection algorithm that utilizes a variety of advanced computer vision and machine learning techniques to normalize and match the images, remove artifacts, and detect defects. The flagged socket images can be manually dispositioned by the user and the socket can be sent for repair or cleaning as needed.","PeriodicalId":436890,"journal":{"name":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"251 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Real-Time Automated Socket Inspection using Advanced Computer Vision and Machine Learning : DI: Defect Inspection and Reduction\",\"authors\":\"C. Edwards, Aditya Kumar, Alex Vaske, Nathan McDaniel, Dipali Pradhan, Debashis Panda\",\"doi\":\"10.1109/asmc54647.2022.9792494\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Our test tools pick and place units into sockets for electrical testing. Defects or loose debris accumulated inside the test sockets will likely damage each subsequent unit being tested until the issue is detected and the defective socket is repaired or replaced. To resolve this critical issue, we equipped each pick-and-place arm with a new machine vision system designed to fit inside the existing tool. The limited footprint constraints required a highly compact imaging system which resulted in a variety of image artifacts, creating several unique challenges for the inspection system. We developed an inspection algorithm that utilizes a variety of advanced computer vision and machine learning techniques to normalize and match the images, remove artifacts, and detect defects. The flagged socket images can be manually dispositioned by the user and the socket can be sent for repair or cleaning as needed.\",\"PeriodicalId\":436890,\"journal\":{\"name\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"251 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/asmc54647.2022.9792494\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/asmc54647.2022.9792494","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Real-Time Automated Socket Inspection using Advanced Computer Vision and Machine Learning : DI: Defect Inspection and Reduction
Our test tools pick and place units into sockets for electrical testing. Defects or loose debris accumulated inside the test sockets will likely damage each subsequent unit being tested until the issue is detected and the defective socket is repaired or replaced. To resolve this critical issue, we equipped each pick-and-place arm with a new machine vision system designed to fit inside the existing tool. The limited footprint constraints required a highly compact imaging system which resulted in a variety of image artifacts, creating several unique challenges for the inspection system. We developed an inspection algorithm that utilizes a variety of advanced computer vision and machine learning techniques to normalize and match the images, remove artifacts, and detect defects. The flagged socket images can be manually dispositioned by the user and the socket can be sent for repair or cleaning as needed.