A system-in-package device which can reach 200 °C at most

This paper designs a System-in-Package (SiP) device with DSP + FPGA + ADC as the basic architecture. The diffusion thermal resistance model of SiP devices is established, which reduces the thermal resistance of the device by using special encapsulation materials and high heat transfer efficiency. At the same time, the temperature grade of SiP devices is improved. The laboratory temperature test shows that the Q factor of the critical output path is not less than 15 and the normalized gain of the acquisition signal is less than 0.4 dB in the band range. The SiP device can be applied to the high temperature environment at 200°C, and solves the problem of digital pulse sequence generation and low signal to noise ratio (SNR) signal acquisition in low field nuclear magnetic resonance (NMR) logging equipment.