在CMOS技术中通过布局设计硬化了一种替代辐射

Carlos Alfredo Pelcastre Ortega, M. L. Aranda
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引用次数: 1

摘要

用于航空航天工业、粒子物理研究和医疗设备的电子电路需要在放射性环境中工作,长期暴露于辐射会导致其电气性能退化。器件退化的原因之一是总电离剂量(TID)的影响。氧化硅(SiO2)中正电荷的积累是产生TID的主要问题,电荷的积累引起阈值电压、漏电流的变化以及n型区之间寄生晶体管的产生。为了减少TID引起的降解,研究了几种技术,其中之一是设计辐射硬化(RHBD)。提出了一种新的布局技术——沙漏晶体管;这种新的布局改善了对TID的辐射响应。利用物理模型和130nm CMOS技术进行了三维仿真,分析了新布局下器件的行为。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An alternative radiation hardened by layout design in a CMOS technology
Electronic circuits used in aerospace industry, particle physics research, and medical equipment need to work in radioactive environments and long-term exposure to radiation causes degradation of their electrical properties. One of the causes of device degradation is the effect of the total ionizing dose (TID). The accumulation of positive charges in silicon oxide (SiO2) is the main problem that generates the TID, the accumulation of charges causes changes in the threshold voltage, leakage current and the generation of parasitic transistors between N-type regions. To reduce the degradation caused by TID, several techniques have been researched, one of which is radiation hardening by design (RHBD). This paper presents a new layout technique named hourglass transistor; this new layout improves the radiation response to TID. The behavior of devices with the new layout was analyzed using 3D simulations with physical models, and a 130nm CMOS technology.
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