{"title":"具有180°混合片上耦合器的CMOS功率放大器,用于4G应用","authors":"Mahima Arrawatia, M. Baghini, G. Kumar","doi":"10.1109/MWSCAS.2015.7282076","DOIUrl":null,"url":null,"abstract":"This paper presents a CMOS Class AB power amplifier with an on-chip 180° hybrid coupler for 4G applications. Two-stage power amplifier architecture with a combination of low voltage core transistor and high voltage I/O transistors, is designed to achieve the power gain in the 180nm standard CMOS technology. The driver stage has a power gain of 18.5dB and linear output power of 12.9dBm. The power stage has a gain of 13.7dB and P1dB of 24.4dBm. The paper also presents an on-chip 180° hybrid coupler, designed in the same technology, for combining the power generated from individual power amplifiers. The measured results of the coupler show an isolation better than -30dB, S11 better than -20dB and, S21 and S31 equal to -5.4dB, at 2.35GHz. The complete differential power amplifier using the on-chip coupler gives P1dB of 26.4dBm and saturated output power of 27.4dBm. As compared to all the reported on-chip couplers configurations, use of 180° hybrid coupler leads to better load insensitivity as well as improved linearity due to the second harmonic cancellation.","PeriodicalId":216613,"journal":{"name":"2015 IEEE 58th International Midwest Symposium on Circuits and Systems (MWSCAS)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A CMOS power amplifier with 180° hybrid on-chip coupler for 4G applications\",\"authors\":\"Mahima Arrawatia, M. Baghini, G. Kumar\",\"doi\":\"10.1109/MWSCAS.2015.7282076\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a CMOS Class AB power amplifier with an on-chip 180° hybrid coupler for 4G applications. Two-stage power amplifier architecture with a combination of low voltage core transistor and high voltage I/O transistors, is designed to achieve the power gain in the 180nm standard CMOS technology. The driver stage has a power gain of 18.5dB and linear output power of 12.9dBm. The power stage has a gain of 13.7dB and P1dB of 24.4dBm. The paper also presents an on-chip 180° hybrid coupler, designed in the same technology, for combining the power generated from individual power amplifiers. The measured results of the coupler show an isolation better than -30dB, S11 better than -20dB and, S21 and S31 equal to -5.4dB, at 2.35GHz. The complete differential power amplifier using the on-chip coupler gives P1dB of 26.4dBm and saturated output power of 27.4dBm. As compared to all the reported on-chip couplers configurations, use of 180° hybrid coupler leads to better load insensitivity as well as improved linearity due to the second harmonic cancellation.\",\"PeriodicalId\":216613,\"journal\":{\"name\":\"2015 IEEE 58th International Midwest Symposium on Circuits and Systems (MWSCAS)\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE 58th International Midwest Symposium on Circuits and Systems (MWSCAS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSCAS.2015.7282076\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 58th International Midwest Symposium on Circuits and Systems (MWSCAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSCAS.2015.7282076","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A CMOS power amplifier with 180° hybrid on-chip coupler for 4G applications
This paper presents a CMOS Class AB power amplifier with an on-chip 180° hybrid coupler for 4G applications. Two-stage power amplifier architecture with a combination of low voltage core transistor and high voltage I/O transistors, is designed to achieve the power gain in the 180nm standard CMOS technology. The driver stage has a power gain of 18.5dB and linear output power of 12.9dBm. The power stage has a gain of 13.7dB and P1dB of 24.4dBm. The paper also presents an on-chip 180° hybrid coupler, designed in the same technology, for combining the power generated from individual power amplifiers. The measured results of the coupler show an isolation better than -30dB, S11 better than -20dB and, S21 and S31 equal to -5.4dB, at 2.35GHz. The complete differential power amplifier using the on-chip coupler gives P1dB of 26.4dBm and saturated output power of 27.4dBm. As compared to all the reported on-chip couplers configurations, use of 180° hybrid coupler leads to better load insensitivity as well as improved linearity due to the second harmonic cancellation.