Si衬底气相吸收对等离子体掺杂过程的影响

R. Higaki, K. Tsutsui, Y. Sasaki, S. Akama, B. Mizuno, S. Ohmi, H. Iwai
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引用次数: 2

摘要

在低能等离子体掺杂过程中,不仅要考虑电离物质,而且要考虑中性物质对掺杂过程的贡献。为了研究这种贡献,进行了气相掺杂与Ar等离子体预处理相结合的实验。气相杂质吸收应受等离子体掺杂引起的Si晶体紊乱的影响。氩等离子体被用来模拟这种效应。结果表明,在暴露于中性B/sub 2/H/sub 6//He气体之前,用Ar等离子体对基底表面进行预处理,可以显著增加来自中性气相的硼剂量。硼被认为在非晶层中被吸收。了解和控制这一现象对于离子辐照和中性物质吸收同时进行的等离子体掺杂技术具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of gas phase absorption into Si substrates on plasma doping process
In the low energy plasma doping process, the contribution of not only ionised species but also neutral species to the doping process should be considered. In order to investigate such a contribution, experiments of gas phase doping combined with Ar plasma pre-treatment were carried out. Gas phase impurity absorption should be affected by the Si crystalline disorder caused by the plasma doping. Ar plasma was used to simulate this effect. As a result, significant increase of boron dose from the neutral gas phase was observed when the substrate surface was pre-treated by Ar plasma prior to exposure to neutral B/sub 2/H/sub 6//He gas. The boron was considered to be absorbed in the amorphous layer. Understanding and control of this phenomenon are important for plasma doping technology, in which ion irradiation and absorption of neutral species proceed simultaneously.
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