T. Komatsu, N. Okazaki, T. Nishihara, S. Kayama, N. Hoshi, J. Aaoyama, T. Shimada
{"title":"一个35ns 1Mb CMOS SRAM","authors":"T. Komatsu, N. Okazaki, T. Nishihara, S. Kayama, N. Hoshi, J. Aaoyama, T. Shimada","doi":"10.1109/ISSCC.1987.1157110","DOIUrl":null,"url":null,"abstract":"A 128×8b CMOS SRAM with TTL input/output levels will be presented. The SRAM has been fabricated in a 1.0μm double-poly silicon double-metal CMOS technology Chip size is 8×13.65mm. Typical standby current is 5μA with 100mW dissipatlon at 10MHz. Noise immunity has been achieved from a dual threshold level data transfer.","PeriodicalId":102932,"journal":{"name":"1987 IEEE International Solid-State Circuits Conference. Digest of Technical Papers","volume":"118 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"A 35ns 1Mb CMOS SRAM\",\"authors\":\"T. Komatsu, N. Okazaki, T. Nishihara, S. Kayama, N. Hoshi, J. Aaoyama, T. Shimada\",\"doi\":\"10.1109/ISSCC.1987.1157110\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A 128×8b CMOS SRAM with TTL input/output levels will be presented. The SRAM has been fabricated in a 1.0μm double-poly silicon double-metal CMOS technology Chip size is 8×13.65mm. Typical standby current is 5μA with 100mW dissipatlon at 10MHz. Noise immunity has been achieved from a dual threshold level data transfer.\",\"PeriodicalId\":102932,\"journal\":{\"name\":\"1987 IEEE International Solid-State Circuits Conference. Digest of Technical Papers\",\"volume\":\"118 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1987 IEEE International Solid-State Circuits Conference. Digest of Technical Papers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.1987.1157110\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1987 IEEE International Solid-State Circuits Conference. Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.1987.1157110","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 128×8b CMOS SRAM with TTL input/output levels will be presented. The SRAM has been fabricated in a 1.0μm double-poly silicon double-metal CMOS technology Chip size is 8×13.65mm. Typical standby current is 5μA with 100mW dissipatlon at 10MHz. Noise immunity has been achieved from a dual threshold level data transfer.