{"title":"周期和不平衡程度对Cr/CrN磁控溅射纳米多层膜结构和电阻率的影响","authors":"D. Marulanda, A. Lousa, J. Olaya","doi":"10.1109/NMDC.2010.5652521","DOIUrl":null,"url":null,"abstract":"Cr/CrN nano-multilayers have been produced by varying the period and the degree of unbalancing in a magnetron sputtering system in order to study the influence of these parameters in the electrical properties. X-ray Diffraction (XRD) was used to investigate the microstructure characteristics of the multilayers and the Four Point Probe (FPP) technique in the Van der Pawn mode was used to evaluate electrical resistivity. The results show that the resistivity strongly depends on the period and the degree of unbalancing of the magnetron. These nano-multilayers are proposed to be used as contacts in Cu metallization and as diffusion barriers between copper and silicon.","PeriodicalId":423557,"journal":{"name":"2010 IEEE Nanotechnology Materials and Devices Conference","volume":"287 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of period and degree of unbalancing on the structure and resistivity of Cr/CrN magnetron sputtered nano-multilayers\",\"authors\":\"D. Marulanda, A. Lousa, J. Olaya\",\"doi\":\"10.1109/NMDC.2010.5652521\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Cr/CrN nano-multilayers have been produced by varying the period and the degree of unbalancing in a magnetron sputtering system in order to study the influence of these parameters in the electrical properties. X-ray Diffraction (XRD) was used to investigate the microstructure characteristics of the multilayers and the Four Point Probe (FPP) technique in the Van der Pawn mode was used to evaluate electrical resistivity. The results show that the resistivity strongly depends on the period and the degree of unbalancing of the magnetron. These nano-multilayers are proposed to be used as contacts in Cu metallization and as diffusion barriers between copper and silicon.\",\"PeriodicalId\":423557,\"journal\":{\"name\":\"2010 IEEE Nanotechnology Materials and Devices Conference\",\"volume\":\"287 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-12-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE Nanotechnology Materials and Devices Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/NMDC.2010.5652521\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE Nanotechnology Materials and Devices Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NMDC.2010.5652521","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
通过改变磁控溅射系统的周期和不平衡度,制备了Cr/CrN纳米多层膜,研究了这些参数对镀层电性能的影响。利用x射线衍射(XRD)研究了多层材料的微观结构特征,并利用Van der Pawn模式下的四点探针(FPP)技术评估了多层材料的电阻率。结果表明,电阻率与磁控管的周期和不平衡程度密切相关。这些纳米多层膜被提议用作铜金属化的接触和铜与硅之间的扩散屏障。
Effect of period and degree of unbalancing on the structure and resistivity of Cr/CrN magnetron sputtered nano-multilayers
Cr/CrN nano-multilayers have been produced by varying the period and the degree of unbalancing in a magnetron sputtering system in order to study the influence of these parameters in the electrical properties. X-ray Diffraction (XRD) was used to investigate the microstructure characteristics of the multilayers and the Four Point Probe (FPP) technique in the Van der Pawn mode was used to evaluate electrical resistivity. The results show that the resistivity strongly depends on the period and the degree of unbalancing of the magnetron. These nano-multilayers are proposed to be used as contacts in Cu metallization and as diffusion barriers between copper and silicon.